| View Larger Image | Stress-Induced Phenomena in Metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / Materials Physics and Applications) | Hardcoverby Shinichi Ogawa (Editor), Paul S. Ho (Editor), Ehrenfried Zschech (Editor)
| List Price: | $99.00 | | | Available: | Usually ships in 24 hours |
| | Binding: | Hardcover | | Publisher: | American Institute of Physics | | Edition: | 1st Edition | | Page Count: | 204 Pages | | Publication Date: | November 13, 2007 |
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Product Description
All papers were peer reviewed. The conference was on reliability related science in ULSI interconnect, and the main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. |
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