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Closing the Gap Between ASIC & Custom: Tools and Techniques for High-Performance ASIC Design
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Closing the Gap Between ASIC & Custom: Tools and Techniques for High-Performance ASIC Design | Hardcover

by David Chinnery (Author), Kurt Keutzer (Author)

List Price: $159.00  
Price:  $142.34
You Save:  $16.66 (10%)
Available:  Usually ships in 24 hours

Binding:  Hardcover
Publisher:  Springer
Edition:  1st Edition
Page Count:  432 Pages
Publication Date:  June 30, 2002
Sales Rank:  843,570rd

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EDITORIAL REVIEWS


Product Description
Carefully details design tools and techniques for high-performance ASIC design techniques. These techniques are illustrated by designs running two to three times the speed of typical designs in the same process generation.


CUSTOMER REVIEWS (Average Customer Rating: 5.0 based on 2 reviews)

Shows the way. by J. W. Byrn (Fort Collins, CO USA) 5 Stars
January 09, 2007
This is a very useful book to help focus on how to develop high performance designs. It is a little dated on the technologies covered but gets the job done. One thing to remember is that microprocessor development methods usually will become ASIC development methods after a number of years and related EDA tool development.

A study of fast processor design by Jonah Probell (Silicon Valley & Boston) 5 Stars
February 09, 2004
Whether trying to maximize the speed of a standard cell ASIC processor design or minimize the design time of a full custom processor this book describes, in detail, the considerations involved. The authors draw on real-world designs and extensively review several in particular. The book describes the impact on resulting processor performance of pipeline depth, clock tree design, register and latch choice, setup and clock-to-q times, slack passing, dynamic logic, logic design style, richness of standard cell library, wire and transistor sizing, floorplanning and other layout concerns, and the exploitation of process variation.This book focuses strictly on processor circuit design and does not discuss software design, instruction set architecture, or die size and power issues.

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