Milestone in Microsystems TechnologyOctober 16, 2003Lithographic processes are applied to manufacturing components of microsystem technology. In X-ray as well as UV ranges the SU-8™ photoresist allows for the production of three-dimensional metallic micro structures with large aspect rations by LIGA (Lithography Electroplating Moulding) processing. Lead by Dr. Holger Löwe, a team of experts from the Institut für Mikrotechnik Mainz GmbH (IMM) and the M-O-T Mikro- und Oberfl'¤chentechnik GmbH (Speyer) developed a new method to completely remove SU-8™ photoresist from micro structured components. So far the outstanding properties and possibilities of structuring SU-8™ could only be used to a limited extent. The main reason was that removing the processed SU-8™ photoresist, i.e. the mould, from the galvanic structures was difficult and often at disadvantage for the micro-structured component. Searched for globally, the key to solving the problem is to be found in a process for removing PMMA X-ray photoresist which was already patented by IMM in 1998 (DE 198 13 235). Through suitable modification this process could be adjusted to the needs of the removal of SU-8™ photoresist. The new method also operates wet-chemically as described in the patent. Electroformed micro parts made of copper, nickel and nickel alloys, in particular nickel iron alloys, can be released from the SU-8™ photoresist without noticeable attack of the corrosive medium. At present, the expert team of IMM and M-O-T investigates how to remove SU-8 from micro parts made of gold or silver. The development of appropriate plant technology has been completed. Systems which are also integrable into an existing clean room environment can already be obtained at M-O-T. | |||||||||||||||||||||
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