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UB Engineers Prove That Carbon Nanotubes Are Superior to Metals for Electronics
In the quest to pack ever-smaller electronic devices more densely with integrated circuits, nanotechnology researchers keep running up against some unpleasant truths: higher current density induces electromigration and thermomigration, phenomena that damage metal conductors and produce heat, which leads to premature failure of devices.   view more (2009-03-23)

NIST develops test method for key micromechanical property
Engineers and researchers designing and building new microelectromechanical systems (MEMS) can benefit from a new test method developed at the National Institute of Standards and Technology (NIST) to measure a key mechanical property of such systems: elasticity.   view more (2008-01-10)

Researchers at University of Pennsylvania develop method for mass production of nanogap electrodes
Researchers at the University of Pennsylvania have developed a reliable, reproducible method for parallel fabrication of multiple nanogap electrodes, a development crucial to the creation of mass-produced nanoscale electronics.   view more (2007-08-17)

The original nanoworkout -- Helping carbon nanotubes get into shape
Researchers at Rensselaer Polytechnic Institute have developed a new method of compacting carbon nanotubes into dense bundles.   view more (2007-06-07)

Liquid cooling with microfluidic channels helps computer processors beat the heat
A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and improved reliability.   view more (2005-06-21)
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