Articles tagged with Chemical Etching
Researchers at Nagoya University and Tokyo Electron Miyagi Ltd. have developed a new semiconductor etching method that significantly reduces processing time and enhances energy efficiency. The process employs plasma etching with hydrogen fluoride at very low temperatures, eliminating the need for fluorocarbon gases.
Researchers successfully etched hafnium oxide films at atomic-level precision and smoothness without halogen gases. The new method uses nitrogen and oxygen plasmas to form volatile byproducts, resulting in reduced surface roughness and improved device performance.
SiC-based pressure sensors offer promising solutions for extreme environments due to their wide bandgap, high carrier saturation drift rate, and strong chemical stability. The review highlights key technologies, including epitaxial layers, piezoresistive effect, ohmic contacts, etching, and sensor packaging.
UCLA doctoral student Yilin Wong noticed spiral patterns on her Germanium chip sample after leaving it overnight. The patterns were influenced by residual stress in the metal film, with different changes in experiment parameters generating various shapes.
Researchers at Linköping University have developed a new technology that adds xenon to digital memories, allowing for even material coating in small cavities. This breakthrough enables more information storage in the same physical size, with 4 terabytes possible in a memory card once holding only 64 megabytes.
Scientists at Linköping University have created sheets of gold only a single atom layer thick, termed goldene. This material has given gold new properties that can make it suitable for applications such as carbon dioxide conversion, hydrogen production, and selective production of value-added chemicals.
Researchers at Linköping University have developed a method to synthesize hundreds of new 2D materials, expanding the possibilities for energy storage, catalysis, and water purification. The study uses a three-step process, including large-scale computations and chemical exfoliation, to identify and create suitable materials.
Researchers have developed a chemical etching method to widen the pores of metal-organic frameworks (MOFs), which could improve their applications in fuel cells and as catalysts. The new MOF structure enables faster transfer of chemicals, enhancing activity and stability.
Researchers developed a photoelectrochemical technique to precisely tune the lasing wavelength of microdisk lasers with subnanometric accuracy. The new approach facilitates the fabrication of micro- and nano-laser batches with precise emission wavelengths.
Researchers developed a chemical scissors-mediated structural editing strategy to regulate the structure and elemental composition of MAX phases/MXenes. This approach enables the creation of novel MAX phase and MXene materials with improved functional applications.
Researchers developed a chemical scissor to split and stitch nanoscopic layers of two-dimensional materials, opening pathways to sustainable energy technologies. This new process allows for structurally splitting, editing, and reconstituting layered materials with exceptional properties.
Researchers at Nagoya University developed a new dry etching method for metal carbides, allowing for the selective removal of TiAlC from other compounds. This technique enables the fabrication of gate-all-around transistors with improved performance and reduced leakage.
Researchers at The University of Tokyo have developed a cheap and simple method to bond polymers to galvanized steel, resulting in lightweight and durable materials. The process involves pre-treating the steel with an acid wash and dipping it in hot water, creating nanoscale needle structures that allow for strong mechanical linkages.
MIT researchers have developed a new approach to assemble nanoscale devices from the bottom up, using precise forces to arrange particles and transfer them to surfaces. This technique enables the formation of high-resolution, nanoscale features integrated with nanoparticles, boosting device performance.
Researchers created silicon nanopillars using MacEtch, a wet etching technique that generates light particles at the right wavelength to proliferate in optical fibers. This breakthrough enables practical quantum communication via optical fibers.
A new study uses a microspectroscopic technique to measure micro- and nano-sized plastics in steam-disinfected silicone-rubber baby bottle nipples. The research found that these fine particles can be released into the environment and ingested by babies, posing health risks.
Researchers at Penn State have developed a chemical-free method for etching nanoscale features on silicon wafers. The technique, called tribochemical reaction, uses a scanning probe microscope to remove single layers of atoms from the surface without damaging underlying layers.
Harvard researchers have developed a technique to fabricate high-quality lithium niobate devices with ultralow loss and high optical confinement. This breakthrough opens the door to practical integrated photonic circuits for applications in quantum photonics, microwave-to-optical conversion, and more.
Researchers at the University of Illinois developed a method to chemically etch patterned arrays in gallium arsenide, used in solar cells and lasers. The new technique, called metal-assisted chemical etching (MacEtch), is faster and less expensive than traditional dry etch methods.