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CityUHK pioneers breakthrough in 3DIC semiconductor packaging materials

A research team from City University of Hong Kong has developed innovative packaging material solutions using patented chemical additives to control material microstructures. This approach aims to improve the performance and production efficiency of advanced 3DIC packaging, enabling faster and more reliable connections in stacked chips.

Aranet4 Home CO2 Monitor

Aranet4 Home CO2 Monitor tracks ventilation quality in labs, classrooms, and conference rooms with long battery life and clear e-ink readouts.

3D printing approaches atomic dimensions

Researchers have developed a new electrochemical technique for printing metal objects at the nanoscale, achieving resolutions of up to 25 nanometres in diameter. This technology has vast potential applications in fields like microelectronics, sensor technology, and battery production.

Next generation of watch springs

Researchers at Empa develop high-performance watch springs through electroplating, enabling improved accuracy and long-term stability. The team's goal is to master the process of miniaturization and understand its effects on material properties.

SAMSUNG T9 Portable SSD 2TB

SAMSUNG T9 Portable SSD 2TB transfers large imagery and model outputs quickly between field laptops, lab workstations, and secure archives.

Electroplating delivers high-energy, high-power batteries

Electroplating enables the production of high-quality, high-performance battery materials, opening doors to flexible and solid-state batteries. The new method bypasses traditional powder and glue processes, resulting in 30% more energy storage and faster charging.

Control of molecular motion by metal-plated 3-D printed plastic pieces

Researchers developed a novel fabrication method combining 3D printing and electroplating to produce complex metallic structures for molecular beam-splitting. This approach enables the creation of high-voltage electrodes with impeccable surface properties and precision alignment, overcoming previous fabrication problems.