Researchers developed a liquid metal-based stretchable soldering sticker patch to resolve the issue of electrical connection between rigid chips and soft conductors. The technology uses freestanding liquid metal-nanowire composites to create a stable interface, allowing for direct connection between elastic electrodes and hard chips.
A new iPMA-type Hexa-technology in Magnetic Tunnel Junctions (MTJ) is showcased for improving ultra-low power consumption in IoT edge-devices and other applications. The 25 nm iPMA-type Hexa-MTJ technology satisfies BEOL design rules for X nm generation CMOS nodes, enabling seamless scaling.
A new ultra-affordable hearing aid called LoCHAid has been developed to combat age-related hearing loss, costing just $0.98 per unit. The device is designed to be marketable over-the-counter and can be repaired by minimally skilled users, making it accessible to those in low- and middle-income countries.
Researchers developed a cost-effective optical manipulation platform to assemble electronic components using optoelectronic tweezers. The technique allows parallel micromanipulation of particles and can be used to create safer and faster-charging mobile device batteries.
The team created electronic devices using elastomeric nanosheet film that is 50 times more elastic than previously reported polymers. The new assembly method uses inkjet printing and low-temperature fixing to produce durable and functional devices that are ultra-thin and flexible.
Researchers at Iowa State University have created micro-scale, liquid-metal particles that can be used for heat-free soldering and metal processing without high temperatures. The discovery has significant implications for manufacturing, with potential applications in the fabrication, repair, and processing of metals.
Researchers have developed compounds that can be applied as a liquid or paste to join two pieces of a semiconductor by heating them to several hundred degrees Celsius, creating seamless joints. This breakthrough technology has diverse applications in industries such as printable electronics, 3-D printing, and solar cells.
Scientists at the University of Twente have successfully folded flat sheets of silicon nitride into complex 3D structures using a custom software program and water. The technique has potential applications in delivering drugs to targeted areas of the body or performing autonomous microsurgery.
University of Illinois researchers have developed a way to heal gaps in wires using carbon nanotubes, which are heated to trigger a local chemical reaction depositing metal to 'solder' the junctions. This process improves device performance by an order of magnitude.
Scientists have developed a new gold-based solder that forms strong, liquid-tight seals when used in laser-welding cuts during intestinal surgery, potentially reducing complications and improving patient outcomes.
Researchers from the University of Michigan have discovered that metal alloys can degrade due to diffusion, a process where atoms hop through the material, changing its structure. This finding has significant implications for the development of longer-lasting alloys, particularly in electronic materials like solder.
The European Union's ban on lead in electronic appliances has led to the widespread adoption of Ames Laboratory's lead-free solder, which was patented in 1996. The solder blend of tin-silver-copper alloy offers a lower melting temperature and greater strength than other alternatives.
Researchers have made significant progress in developing lead-free solders and electrically-conductive adhesives, offering environmentally friendly alternatives to conventional solder materials. However, challenges remain, including high processing temperatures and conductivity fatigue.