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The research group led by Prof. Seung Hwan Ko, in Dept. of Mechanical Engineering in Seoul National University, developed liquid metal based stretchable room temperature soldering sticker patch

Researchers developed a liquid metal-based stretchable soldering sticker patch to resolve the issue of electrical connection between rigid chips and soft conductors. The technology uses freestanding liquid metal-nanowire composites to create a stable interface, allowing for direct connection between elastic electrodes and hard chips.

Meta Quest 3 512GB

Meta Quest 3 512GB enables immersive mission planning, terrain rehearsal, and interactive STEM demos with high-resolution mixed-reality experiences.

SAMSUNG T9 Portable SSD 2TB

SAMSUNG T9 Portable SSD 2TB transfers large imagery and model outputs quickly between field laptops, lab workstations, and secure archives.

New solder for semiconductors creates technological possibilities

Researchers have developed compounds that can be applied as a liquid or paste to join two pieces of a semiconductor by heating them to several hundred degrees Celsius, creating seamless joints. This breakthrough technology has diverse applications in industries such as printable electronics, 3-D printing, and solar cells.

Apple AirPods Pro (2nd Generation, USB-C)

Apple AirPods Pro (2nd Generation, USB-C) provide clear calls and strong noise reduction for interviews, conferences, and noisy field environments.

New research shows why metal alloys degrade

Researchers from the University of Michigan have discovered that metal alloys can degrade due to diffusion, a process where atoms hop through the material, changing its structure. This finding has significant implications for the development of longer-lasting alloys, particularly in electronic materials like solder.

Ames Laboratory innovation key to a 'lead-free' Europe

The European Union's ban on lead in electronic appliances has led to the widespread adoption of Ames Laboratory's lead-free solder, which was patented in 1996. The solder blend of tin-silver-copper alloy offers a lower melting temperature and greater strength than other alternatives.

Apple iPhone 17 Pro

Apple iPhone 17 Pro delivers top performance and advanced cameras for field documentation, data collection, and secure research communications.