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Precision in miniature: new microgripper technology for electronics and assembly

02.11.25 | Aerospace Information Research Institute, Chinese Academy of Sciences

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Researchers at the Beijing Institute of Technology have unveiled an innovative electrothermal microgripper that promises to improve microelectronics, biomedical engineering, and MEMS applications. With its remarkable deformation capabilities, excellent size compatibility and reliable catch strength, the new microgripper enables the manipulation and assembly of micro- and nano-scale objects with exceptional efficiency. This technological advancement is poised to enhance microscale engineering and pave the way for innovations across various high-tech industries.

Microgrippers are essential tools for manipulating minute objects, with applications ranging from medical biopsies to microassembly in electronics. However, traditional microgripper technologies have faced significant limitations, including reliance on complex light sources, high voltages, and bulky magnetic systems. These constraints often hinder their use in confined or specialized microenvironments. The growing need for more versatile, efficient, and user-friendly microgrippers has driven recent research efforts toward overcoming these barriers.

A team of researchers led by Professor Huikai Xie from Beijing Institute of Technology recently published (DOI: 10.1038/s41378-024-00821-2) their study in Microsystems & Nanoengineering on January 5, 2024. This study was primarily done by Prof. Xie’s PhD student Hengzhang Yang who is the first author of the paper. Their novel electrothermal microgripper, based on Al-SiO 2 bimorphs, combines remarkable deformation and rapid response capabilities while consuming minimal power, offering a promising solution to the challenges faced by traditional technologies.

The electrothermal microgripper developed by the team represents a significant leap forward in micro-manipulation technology. By utilizing Al-SiO 2 bimorphs as the core structural component, the microgripper takes advantage of the thermal expansion mismatch between aluminum and silicon dioxide to achieve significant reversible deformation. This mechanism allows the microgripper to naturally close due to residual stresses, enabling it to hold samples without any power consumption. Capable of bending more than 100 degrees at just 5 volts, with a response time of under 10 milliseconds, the microgripper delivers impressive speed and accuracy. Furthermore, its ability to grasp and manipulate delicate micro-objects, as demonstrated in tests with PMMA microbeads, proves its robustness. In vibration tests, it successfully endured an average acceleration of 35 g, and in impact tests, it withstood forces exceeding 1600 g, demonstrating its exceptional strength and reliability. These features make the microgripper ideal for precision tasks like "pick-and-place" operations, such as handling solder beads in electronic packaging.

"Electrothermal microgrippers have long been sought after for their potential to simplify micro-manipulation tasks," said by Shuailong Zhang, a professor participating in this study. "Our design not only meets these expectations but also exceeds them by offering a level of precision and reliability that is unmatched in the field."

Looking to the future, the potential applications of this microgripper are vast. In the electronics industry, its precision makes it ideal for tasks such as solder bead placement, where accuracy is critical. In the field of biomedical engineering, the microgripper could revolutionize minimally invasive procedures, such as biopsies, by enabling the precise handling of tissue samples. As the technology continues to evolve, it is expected to spur further innovations in microscale technologies, leading to more efficient and advanced micro-manipulation systems across a variety of sectors.

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References

DOI

10.1038/s41378-024-00821-2

Original Source URL

https://doi.org/10.1038/s41378-024-00821-2

Funding information

This work is supported by the National Key Research and Development Program of China (Nos. 2023YFB3507300, 2022YFA1207100, 2023YFE0112400), National Natural Science Foundation of China (Nos. 6231101499, 62350710218, 62204013, 62102050, and 62074015), Beijing Natural Science Foundation (No. 4242060, L246030), Open Research Fund of State Key Laboratory of Digital Medical Engineering (No. 2023-K02), Henan Province Joint Fund Project (No. 225200810102), Chongqing Municipal Distinguish Young Scholar Program (Grant No. 2024NSCQ-JQX0192), Open Research Fund of Guangdong Provincial Key Laboratory of Advanced Biomaterials (Grant No. KLAB202404002).

About Microsystems & Nanoengineering

Microsystems & Nanoengineering is an online-only, open access international journal devoted to publishing original research results and reviews on all aspects of Micro and Nano Electro Mechanical Systems from fundamental to applied research. The journal is published by Springer Nature in partnership with the Aerospace Information Research Institute, Chinese Academy of Sciences, supported by the State Key Laboratory of Transducer Technology.

Microsystems & Nanoengineering

Not applicable

A microgripper based on electrothermal Al–SiO2 bimorphs

16-Dec-2024

The authors declare that they have no competing interests.

Keywords

Article Information

Contact Information

Yuan Wang
Microsystems & Nanoengineering
mine@aircas.ac.cn

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How to Cite This Article

APA:
Aerospace Information Research Institute, Chinese Academy of Sciences. (2025, February 11). Precision in miniature: new microgripper technology for electronics and assembly. Brightsurf News. https://www.brightsurf.com/news/L590ROV8/precision-in-miniature-new-microgripper-technology-for-electronics-and-assembly.html
MLA:
"Precision in miniature: new microgripper technology for electronics and assembly." Brightsurf News, Feb. 11 2025, https://www.brightsurf.com/news/L590ROV8/precision-in-miniature-new-microgripper-technology-for-electronics-and-assembly.html.