Soft electronics, designed to function under mechanical deformation such as bending, stretching, and folding, have become essential in various applications like wearable electronics, artificial skin, and brain–machine interfaces. Crystalline silicon (c-Si), one of the most mature and reliable materials for high-performance electronic devices, has garnered widespread attention in the field of flexible electronics due to its high electron mobility, stable operation under high current densities, excellent stability at elevated temperatures, and good biocompatibility. However, its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics. Now, researchers from Nanjing University and Yangzhou University, led by Professor Linwei Yu, present a comprehensive review titled “Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering,” offering valuable insights into how geometry engineering can significantly enhance the flexibility and mechanical properties of c-Si.
Why Geometry Engineering Matters
Innovative Strategies for SiNWs Fabrication and Integration
Detection and Characterization of SiNWs
Future Outlook
Geometry engineering has opened up new possibilities for integrating hard silicon into high-performance soft electronics. With its enhanced flexibility, superior mechanical properties, and excellent electrical performance, silicon nanowires are poised to transform the landscape of flexible electronics. Stay tuned for more exciting breakthroughs in this field!
Nano-Micro Letters
Experimental study
Integrating Hard Silicon for High‑Performance Soft Electronics via Geometry Engineering
14-Apr-2025