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NUS CDE researchers design AI hardware that filters out irrelevant visual data

Researchers at NUS CDE have developed a reconfigurable transistor that can switch between filtering image data and performing AI network functions, reducing energy consumption and improving accuracy in handwritten-digit recognition simulations. The device uses a spiking neural network-in-logic architecture to selectively pass relevant ...

SourceNational University of Singapore College of Design and Engineering·JournalNature Electronics·TypeExperimental study·DateSep 25, 2026

Broadband distributed amplifier for data centers, measurement systems and sensors

Researchers at Fraunhofer IAF have developed a monolithic microwave integrated circuit (MMIC) with a gain of 11 ± 2 dB in the frequency range between 4 and 420 GHz. The MMIC achieves low noise and high output power, making it suitable for high-bandwidth applications such as optical data transmission.

SourceFraunhofer Institute for Applied Solid State Physics·JournalIEEE Microwave and Wireless Technology Letters·DateSep 24, 2026

PolyU develops quantum-tunnelling field-effect transistor to overcome barriers to integrated-circuit chip development

Researchers at PolyU have engineered a novel tunnelling field-effect transistor using 2D nanomaterials, breaking through the 60 mV decade’ boundary to create ultra-low-power, high-performance ICs essential for emerging AI chips. The breakthrough paves the way for energy-efficient computing and next-generation AI chips.

NUS CDE researchers develop atom-thin carbon insulator for next-generation microchips

A team from NUS developed an atom-thin film of amorphous carbon with a low k-value, addressing the interconnect bottleneck in microchips. The film withstood strong electric fields and prevented copper ions from passing through, paving the way for wider copper lines and faster data transfer.

SourceNational University of Singapore College of Design and Engineering·JournalNature Electronics·TypeExperimental study·DateAug 19, 2026

Low energy way to control tiny electronic structures with light

A team of researchers at Flinders University has discovered a novel method to manipulate tiny nanoscale 'bubble' domains within ferroelectric crystals using near-visible light. The study reveals that these structures rapidly expand after the light is switched off, triggering a temporary change in their electronic state.

SourceFlinders University·JournalAdvanced Functional Materials·TypeExperimental study·DateAug 3, 2026

Scientists unveil technique to build ultra-thin material stacks that promise quantum breakthrough

Researchers unveiled a technique to build ultra-clean 2D heterostructures using muscovite crystals, eliminating microscopic residues that disrupt electronic device performance. This method enables precise stacking of atomic layers, leading to new properties and potential breakthroughs in quantum computing and nanoelectronics.

SourceUniversity of Southampton·JournalNature Communications·TypeExperimental study·DateJul 14, 2026

"Semiconductors enter the era of skyscrapers": Stacking chips like high-rise buildings to boost performance

Researchers developed a technology to stack ultrathin semiconductor chips with improved integration density, overcoming challenges of chip thickness and warpage. The process enables the reliable stacking of over ten chips, potentially leading to significant improvements in AI semiconductor performance.

SourcePohang University of Science & Technology (POSTECH)·JournalResults in Engineering·DateJul 7, 2026

How reliable is my computer chip?

Researchers at TU Wien have developed a new practical method to estimate the actual expected lifetime of electronic components using novel materials. This approach allows for reliable and rapid lifetime prediction, helping industry identify the right materials and manufacturing techniques more quickly and with greater confidence.

SourceVienna University of Technology·JournalNature Electronics·TypeExperimental study·DateJul 6, 2026

Restoring lost senses: one technology for both artificial vision and touch

Researchers have discovered that advanced brain interfacing technology used for both touch and vision prostheses is almost identical, despite being developed separately. This breakthrough could lead to faster restoration of lost senses, including sight and motor function, with a unified technology that benefits both patient groups.

SourceChalmers University of Technology·JournalNature Reviews Bioengineering·TypeLiterature review·DateJun 30, 2026

UCLA-led research finds synchronized electron movement can trigger electrical signals more than 100-fold

A UCLA-led team discovered that synchronized electron movement can trigger electrical signals more than 100 times larger than conventional electronic materials. This breakthrough could lead to smaller, more energy-efficient devices using a quantum-like collective state of matter called charge-density-wave.

SourceUniversity of California - Los Angeles·JournalNature Electronics·TypeExperimental study·DateJun 18, 2026

Atom-thin coating developed from NUS CDE–Applied Materials partnership tackles key bottleneck in chip miniaturisation

Researchers have developed a single material, tungsten disulfide, that can serve as both barrier and liner in copper wiring, allowing for improved chip performance. The coating is just 0.7 nanometres thick, roughly the width of a few atoms, and has shown significant improvements in resistance and reliability.

SourceNational University of Singapore College of Design and Engineering·JournalNature Electronics·TypeExperimental study·DateJun 17, 2026

Semiconductors enter the “multi-tasking” era: New device cuts required components by 75% and quadruples processing speed

Researchers developed a transistor technology that enables a single device to perform multiple circuit functions simultaneously, simplifying circuit design and increasing data processing speed. The new approach reduces required transistors by 75% and increases data processing speed fourfold.

SourcePohang University of Science & Technology (POSTECH)·JournalAdvanced Functional Materials·DateJun 5, 2026

Stretchable brain-inspired electronics erase the physical boundary between human and machine

Researchers have developed soft, brain-inspired electronics that can sense, store, and process information while conforming to biological tissues. These devices mimic the chemical processing of the human brain, executing complex tasks like heart rhythm classification at ultra-low voltages.

SourceInternational Journal of Extreme Manufacturing·JournalInternational Journal of Extreme Manufacturing·DateJun 4, 2026

"Breaking the limits of OLED: Postech achieves low-votage freely color tunable ultra-pure laser emission"

A research team at Postech has developed a next-generation laser emission platform capable of precise color control under battery-level low voltage. The technology achieves ultra-high color purity and continuous spectral tunability within a single device, overcoming limitations of conventional display light sources.

SourcePohang University of Science & Technology (POSTECH)·JournalLaser & Photonics Review·DateMay 12, 2026

Programmable ‘smart stamp’ transfers microscopic chips to build 3D circuits

Researchers develop programmable system to selectively pick up and place delicate electronic components, enabling mass production of defect-free displays and 3D microchips. The 'smart stamp' technology uses localized heating to control a polymer's stickiness, allowing precise transfer of semiconductor chips and other materials.

SourceInternational Journal of Extreme Manufacturing·JournalInternational Journal of Extreme Manufacturing·DateMar 24, 2026

Ultrathin ferroelectric capacitors for next-generation memory devices

Researchers from Japan successfully downscaled a total ferroelectric memory capacitor stack to just 30 nm, maintaining high remanent polarization and paving the way for compact and efficient on-chip memory. This breakthrough demonstrates compatibility with semiconductor devices and paves the way for future technologies.

SourceInstitute of Science Tokyo·JournalAdvanced Electronic Materials·TypeExperimental study·DateJan 5, 2026

Extreme manufacturing enables ultra-soft, ultra-small, high-density neural implants

Researchers propose a new design approach for intracortical electrodes that can record from many neurons at once without damaging them. The authors outline various manufacturing approaches, including advanced silicon micromachining and thermal fiber drawing, to create flexible devices with low stiffness.

SourceInternational Journal of Extreme Manufacturing·JournalInternational Journal of Extreme Manufacturing·DateDec 17, 2025

Korean researchers’ single memristor replaces both the driving transistor and storage capacitor in micro-LED

A team of Korean researchers has successfully integrated a single memristor into micro-LED pixels, replacing the traditional driving transistor and storage capacitor. This innovation enables more efficient and easier-to-build displays with improved brightness and color accuracy.

SourceInternational Journal of Extreme Manufacturing·JournalInternational Journal of Extreme Manufacturing·DateNov 6, 2025

Innovative transistors for quantum chips

Researchers at TU Wien developed a new form of doping called modulation acceptor doping (MAD) that improves conductivity without incorporating foreign atoms. This technology enables faster switching times, lower power consumption, and better performance in quantum chips.

SourceVienna University of Technology·JournalIEEE Electron Device Letters·TypeExperimental study·DateSep 23, 2025

Fluorinated polyimide: High toughness and low dielectric properties pave new path for high-frequency communication materials

Researchers have developed a novel fluorinated polyimide with improved mechanical properties and reduced dielectric constant, making it suitable for advanced microelectronic packaging. The material achieves low dielectric properties, excellent mechanical toughness, and synergistic optimization of comprehensive properties.

SourceIndustrial Chemistry & Materials·JournalIndustrial Chemistry and Materials·TypeExperimental study·DateJul 10, 2025

On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation

A novel electrochemical microfluidic workstation detects additive concentrations in acidic copper plating solution with average relative errors below 10%. The system reduces single-test solution consumption to 220 microliters, enabling online monitoring of process stability and reliability.

SourceIndustrial Chemistry & Materials·JournalIndustrial Chemistry and Materials·TypeExperimental study·DateJul 3, 2025

Exploring scalable pathways for cost-effective memristors using solution-processed 2D materials

The article discusses the use of solution-processed 2D materials to fabricate memristors, offering a scalable alternative to traditional methods. Recent breakthroughs have overcome manufacturing limitations, producing larger and less-damaged nanosheets with improved device performance.

SourceInternational Journal of Extreme Manufacturing·JournalInternational Journal of Extreme Manufacturing·DateJul 2, 2025

Military combatants usher in an era of personalized training with new materials​

A new e-textile platform developed by KAIST's research team combines 3D printing technology with advanced materials engineering to create customized training models for individual combatants. The platform uses flexible and highly durable sensors and electrodes printed directly onto textile substrates, enabling precise movement and huma...

SourceThe Korea Advanced Institute of Science and Technology (KAIST)·Journalnpj Flexible Electronics·TypeExperimental study·DateJun 28, 2025

Bulking up for solar power

Researchers at Kyoto University have created a new artificial heterostructure device that mimics broken spatial and time-reversal symmetry, enabling new bulk photovoltaic effects. The device shows promise for next-generation solar cells with improved efficiency and multifunctionality.

SourceKyoto University·JournalNature Communications·TypeExperimental study·DateJun 22, 2025

Novel manufacturing technique for piezoelectric thin films

Empa researchers have developed a novel deposition process for piezoelectric thin films using HiPIMS, producing high-quality layers on insulating substrates at low temperatures. The technique overcomes the challenge of argon inclusions by timing the voltage application to accelerate desired ions.

SourceSwiss Federal Laboratories for Materials Science and Technology (EMPA)·JournalNature Communications·TypeExperimental study·DateJun 3, 2025