Articles tagged with Microelectronics
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Researchers at Martin-Luther-University Halle-Wittenberg discovered a way to convert frequencies to higher ranges using magnetic materials without additional components. This breakthrough could make certain electronic components obsolete and improve the energy efficiency of digital technologies.
Researchers have developed an unsolved problem in microelectronics by creating the world's smallest battery, which can power tiny sub-millimeter-scale computers for about ten hours. The Swiss-roll process enables on-chip batteries for dust-sized computers with high energy density and integrability.
Researchers at NIST have revived and improved the charge pumping method to detect single defects as small as one-tenth of a billionth of a meter. The new technique can indicate where defects are located in transistors, enabling accurate assessment of their impact on performance.
Researchers at Lawrence Berkeley National Laboratory developed a method to stabilize graphene nanoribbons and directly measure their unique magnetic properties. By substituting nitrogen atoms along the zigzag edges, they can discretely tune the local electronic structure without disrupting the magnetic properties.
A team of researchers from Chemnitz University of Technology, IFW Dresden, and Max Planck Institute CBG presents a new type of biomedical tool with a tiny biocompatible microelectronic micro-catheter. The catheter has sensor and actuator functions integrated into its wall, making it highly flexible and adaptable to the body.
Researchers have discovered that negative capacitance in topological transistors can switch at lower voltage, potentially reducing energy losses. This new design could help alleviate the unsustainable energy load of computing, which consumes about 8% of global electricity supply.
A flexible and easy-to-use micropen setup is capable of directly writing on surfaces to a microprecise level. The device allows for the printing of microarrays, lines, curves, and other structures in real-time using biomaterial or conductive ink.
Scientists at Argonne National Laboratory have discovered a method to remove heterostructure thin films containing electrical bubbles from a substrate while keeping them fully intact. This breakthrough may bring new applications in microelectronics and energy storage devices.
Researchers developed an all-nitride superconducting qubit using niobium nitride on a silicon substrate, achieving long coherence times of up to 22 microseconds. The breakthrough paves the way for large-scale integration and potential applications in quantum computers and nodes.
Lehigh University will lead a five-year, $25 million research collaboration to develop new semiconductor materials and scalable manufacturing processes for advanced optoelectronic devices. The initiative aims to transform fields like information technology with quantum technologies.
Researchers from South Korea have developed a method to add metal oxides to graphene, enhancing its physical and chemical properties. This creates composite structures with unique characteristics, suitable for energy storage and flexible devices. The study's findings pave the way for biocompatible, durable, eco-friendly materials.
Researchers create transistors with an ultra-thin metal gate grown as part of the semiconductor crystal, eliminating oxidation scattering. This design improves device performance in high-frequency applications, quantum computing, and qubit applications.
Researchers have developed adaptive microelectronics that can position themselves, manipulate biological tissue, and respond to their environment. These innovative devices use microscopic artificial muscles and sensor signals to adapt to complex anatomical shapes.
Feitian Zhang and Pei Dong received a $15,000 grant to purchase a remotely operated vehicle with GPS for monitoring microelectronic sensors in aquatic environments. The funding will support their research in aquatic environmental monitoring until August 2021.
Researchers have created a new type of chemical thermometer using spin-crossover molecules to create a nanometric-scale thermal map. The innovation enables the measurement of local thermal processes and improves device design.
A novel 5G-MIMO measurement system is now in place at Ferdinand-Braun-Institut, enabling unique measurements and research. The system's large bandwidth and vector calibration ability make it unparalleled for characterizing integrated multi-amplifier designs.
Researchers at UMD are using CRISPR technology to create microelectronic devices that can electronically turn genes on and off. This technique has the potential to bridge the gap between biology and electronics, enabling new wearable and smart devices.
Researchers at Argonne National Laboratory have developed a new molecular layer etching technique that could help fabricate and control material geometries at the nanoscale. The technique uses pulses of gas to remove thin films, potentially opening new doors in microelectronics and extending beyond traditional Moore's Law scaling.
A team of scientists has discovered new details about a type of thin film being explored for advanced microelectronics. The research reveals that the material's local static properties remain intact when transferred from one substrate to another, making it promising for future complex oxide microelectronics.
Physicists have visualized the electronic structure in a microelectronic device for the first time, opening opportunities for high-performance electronics. The technique uses angle-resolved photoemission spectroscopy to measure energy and momentum of electrons, revealing how voltage affects material behavior.
Allison Osmanson, a UTA doctoral student, has received a prestigious fellowship from the Semiconductor Research Corp. to work on microelectronics packaging. She will receive funding and technical guidance from Texas Instruments.
Scientists at NUST MISIS discover that molybdenum disulfide, a promising basis for ultra-small electronic devices, degrades in air due to spontaneous oxidation. However, they also found that the material can be transformed into a solid solution MoS2-xOx, which is an effective catalyst for electromechanical processes.
Researchers from KIT have developed photoresists that can be erased selectively, allowing specific degradation and reassembly of microstructures on the micrometer and nanometer scales. This enables complex geometries with precise filigree structures, applications in biomedicine, microelectronics, and optical metamaterials.
Researchers develop a novel approach to create tailored, tough polymers for 3D printing. The new method uses an ester-activated vinyl sulfonate ester as a chain transfer agent, reducing the risk of shrinkage cracks and increasing material flexibility.
Researchers propose using gallium oxide for producing microelectronics due to its large bandgap and high-breakdown-voltage capabilities. This enables the design of FETs with smaller geometries and improved energy density.
Researchers at UC Santa Cruz have developed a new coating technology using thin-film materials from the electronics industry to improve telescope mirrors. The technology uses atomic layer deposition to create a protective silver coating on large silver-based mirror surfaces, potentially increasing their efficiency and extending their l...
Researchers at University of Illinois Chicago have developed a method using bubble-recoil to mix liquid coolant around high-power microelectronics. This technique is effective both on Earth and in space, where traditional pool-boiling methods fail due to the lack of gravity.
Cosmic rays generated by particles from outside the solar system can alter individual bits of data stored in memory, causing single-event upsets (SEUs) that can be difficult to characterize. The problem is becoming increasingly serious as computer chip technology advances and becomes smaller.
Researchers at UC San Diego have fabricated a semiconductor-free microelectronic device using metamaterials, showing a 1,000% increase in conductivity. The discovery paves the way for faster and more powerful devices, as well as more efficient solar panels.
A $450,000 grant will fund a collaboration between Indiana University and the US Navy to develop new methods for inspecting microelectronic components used in critical military systems. Computer vision technology will be applied to improve the integrity of electronic circuitry, reducing defects and ensuring equipment reliability.
Researchers found that repeated spot microdischarges in microelectronic devices cause a temperature increase, which reduces the electric field and leads to preferential breakdown at the previous discharge location. This study provides insights into the role of residual heat build-up and its impact on device stability.
Researchers at Oregon State University have developed a new method to fabricate silver nanoparticles for printed electronics at room temperature. This breakthrough has the potential to open up new applications in fields such as solar cells, printed circuit boards, and low-emissivity coatings.
Researchers created high-performance 3D lithium-ion microbatteries using 3D holographic lithography and 2D photolithography. The battery has exceptional performance, scalability, and can be integrated with microelectronic devices.
A new thermal imaging technique called plasmon energy expansion thermometry (PEET) allows for precise temperature mapping in tiny electronic circuits. This can help engineers design microprocessors that minimize overheating and improve device performance.
Scientists at USC and UCLA have discovered a way to accurately measure temperatures inside microelectronic devices using a novel technique called Plasmon Energy Expansion Thermometry (PEET). This breakthrough enables better thermal management, leading to faster transistors and lower power consumption.
Researchers from Cambridge University have devised a simple technique to grow carbon nanotubes at five times higher density than previous methods, enabling the potential replacement of metal electronic components in devices such as batteries and spacecraft.
Researchers developed a magnetically actuated peel test technique to measure adhesion strength between thin films in microelectronic devices, photovoltaic cells and MEMS. The fixtureless and non-contact method helps ensure long-term reliability and resistance to thermal and mechanical stresses.
Scientists at the University of Southampton and collaborators are developing new materials like amorphous chalcogenides, bridging glass and semiconductor technology. The project aims to improve device energy efficiencies and support UK's communication and healthcare sectors.
The Megaframe Imager, a new ultrafast camera, uses an extremely sensitive SPAD device to detect viral DNA binding events at low target concentrations. This technology has potential applications in biological processes, automotive collisions, and astronomical observations.
Researchers develop electronic biosensing technology that can detect gene mutations indicative of cancer, potentially leading to faster and more accurate diagnoses. The new platform uses disposable arrays containing thousands of electronic sensors connected to powerful signal processing circuitry.
University of Illinois engineers developed a novel direct-write technique to manufacture metal interconnects, enabling smaller chips and more complex functions. The technique reduces wire bonding area by two orders of magnitude, allowing for faster and more efficient manufacturing.
Researchers at UMass Amherst and Berkeley developed a new method for producing defect-free, thin polymer films using layered block copolymers. The technique achieved densities over 15 times higher than previous efforts, enabling up to 10 terabits per square inch of storage space.
Researchers at NIST demonstrate assembly of a single layer of organic molecules on a silicon crystal substrate compatible with CMOS manufacturing technology. The team builds a working molecular electronic device and verifies its functionality, paving the way for hybrid CMOS-molecular devices.
Researchers at MIT have developed a new transistor technology that could lead to faster operation and smaller devices. The transistors, made from indium gallium arsenide, are 60 nanometers long and can switch and process information quickly.
Scientists at University of Wisconsin-Madison develop technique to time events at the atomic scale, enhancing understanding of material properties and enabling improved memory applications in microelectronics. The breakthrough uses X-rays from Argonne National Laboratory's Advanced Photon Source.
Researchers have developed graphene circuitry comparable to carbon nanotubes, allowing for high-volume production. The material exhibits high electron mobility and coherence, enabling the transport of electrons through waveguides. Challenges ahead include improving patterning techniques and understanding fundamental properties.
Graphene, a material that gives pencils their marking ability, has been used to produce proof-of-principle transistors, loop devices, and circuitry. The researchers hope to use graphene layers as the basis for revolutionary electronic systems that would manipulate electrons as waves rather than particles.
Researchers at Northwestern University have developed a custom-built scanning tunneling microscope to image individual organic molecules on silicon, refining design constraints for molecular electronic devices. The study has also provided insight into surface chemistry, with potential applications in sensing, catalysis, and lubrication.
The Center for Advanced Microelectronics Manufacturing (CAMM) will combine resources from academia, government, and industry to speed up microelectronics manufacturing research and development in a roll-to-roll format. CAMM's R2R research capabilities include flexible displays, 'foldable' radars, and protective clothing.
A team of engineers at Northwestern University has developed a method for precisely aligning multiple types of molecules on a silicon surface at room temperature. This breakthrough enables the construction of nanoscale systems such as molecular transistors or light-emitting diodes, and paves the way for integrating with current technol...
Materials scientist George Harman suggests using corrosion-resistant metals like gold and newer polymers to create microelectronic interconnections that can withstand extreme temperatures. He also proposes the use of flip chips with gold contacts to produce heat-resistant spacecraft electronics.
Researchers developed a hybrid approach to improve microelectronics production, combining lithography and self-assembling materials to achieve nanoscale dimensions. This technology could lead to faster, more powerful devices with increased data capacity, while reducing manufacturing costs.
Researchers at UW-Madison developed a novel diamond film that can be used as a stable platform for biological sensing. The films have proven to be remarkably durable and can withstand multiple cycles of processing DNA, making them suitable for continuous monitoring in high-risk environments.
A UMass research team has developed a new technique for depositing copper films within tiny channels in silicon wafers, promising efficient fabrication of future generations of integrated circuits. The process uses carbon dioxide as a supercritical fluid, offering environmental benefits and the ability to create complex features.
Sandia National Laboratories' tiny acoustic wave sensors can detect specific chemicals in the environment and alert people to potential hazards. The sensors, similar to a 'canary in a mine,' are part of a hand-held chemical detection system called 'chem lab on a chip.'