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Lab to fab at the wafer-scale for SiC

Researchers at Kyoto University have developed a new SiC transistor structure that can operate at 600°C, scaling up production to wafer-level for high-temp applications. The team's achievement enables the fabrication of integrated circuits, opening doors to new areas like jet engine sensors and geothermal resource development.

SourceKyoto University·TypeExperimental study·DateSep 27, 2026

Turning friction heat into a chemical cushion to shape flawless semiconductor crystals

The new method uses a chemical additive to create a sacrificial molecular cushion on the crystal surface, allowing for smoother cutting and reducing defects. This technique slashes subsurface crystal defects to a depth of only 70 nanometers, promising to revolutionize semiconductor manufacturing.

SourceInternational Journal of Extreme Manufacturing·JournalInternational Journal of Extreme Manufacturing·DateSep 15, 2026

A transistor that operates at 600°C

Researchers at Kyoto University have developed a transistor that can operate at 600°C, leveraging the intrinsic properties of SiC to improve controllability and reduce leakage currents. The bottom-gate design significantly enhances the device's performance, paving the way for practical use in extreme-temperature electronics.

SourceKyoto University·JournalAPL Electronic Devices·TypeExperimental study·DateAug 23, 2026

Review of thermal design of SiC power module for motor drive in electrical vehicle application

The paper reviews thermal design of SiC power modules for motor drives in electric vehicles, focusing on optimizing irregular Pinfin structures and collaborative design with DC bus capacitors and motors. Irregular Pinfin arrangements can enhance heat transfer efficiency and reduce pressure drops compared to regular layouts.

SourceCES Transactions on Electrical Machines and Systems·JournalCES Transactions on Electrical Machines and Systems·TypeLiterature review·DateNov 5, 2024

Turning up the heat on data storage

Scientists from Penn created a non-volatile memory device using ferroelectric aluminum scandium nitride (AlScN) to retain data at high temperatures. The device's stability and fast switching properties enable efficient computation in harsh conditions, including space exploration and deep-earth drilling.

SourceUniversity of Pennsylvania·JournalNature Electronics·TypeExperimental study·DateApr 29, 2024

Ultrablack coating could make next-gen telescopes even better

Researchers have created an ultrablack thin-film coating that absorbs nearly all visible light, enhancing the performance of advanced telescopes and optical systems. The coating, developed using atomic layer deposition, is durable enough to withstand harsh conditions and has been applied to magnesium alloys used in aerospace applications.

SourceAmerican Institute of Physics·JournalJournal of Vacuum Science & Technology A Vacuum Surfaces and Films·DateMar 12, 2024

Rice lab finds better way to handle hard-to-recycle material

Rice University researchers have developed a new, energy-efficient process to upcycle glass fiber-reinforced plastic (GFRP) into silicon carbide, widely used in semiconductors and sandpaper. The method involves heating the mixture of GFRP and carbon to extremely high temperatures, transforming it into conductive silicon carbide.

SourceRice University·JournalNature Sustainability·DateFeb 29, 2024

Unravelling auger recombination in bipolar devices under high carrier injection

Scientists from Nagoya Institute of Technology have discovered that Auger recombination rate decreases with increasing excited carrier concentration under high injection conditions. This finding has significant implications for optimizing SiC bipolar device efficiency and development of next-generation high-power devices.

SourceNagoya Institute of Technology·JournalJapanese Journal of Applied Physics·TypeExperimental study·DateJan 17, 2023

Solving the puzzle: Cubic silicon carbide wafers demonstrate high thermal conductivity, second only to diamond

Researchers at the University of Illinois have solved a long-standing puzzle about cubic silicon carbide's thermal conductivity, which is higher than previously thought. The team measured an isotropic high thermal conductivity of over 500 W m–1 K–1, ranking it second only to diamond.

Ultra-thin but tough implantable material could treat spinal cord injury and Parkinson’s disease

Researchers from Griffith University and UNSW Sydney developed a robust and functional material system that overcomes the challenges of long-term implantation in biofluids. The system consists of silicon carbide nanomembranes as the contact surface and silicon dioxide as the protective encapsulation, showing unrivalled stability.

SourceGriffith University·JournalProceedings of the National Academy of Sciences·TypeExperimental study·DateAug 10, 2022

Let machines do the work: Automating semiconductor research with machine learning

Researchers use machine learning to automatically analyze Reflection High-Energy Electron Diffraction (RHEED) data, enabling faster and more efficient discovery of new materials. The study focused on surface superstructures in thin-film silicon surfaces and identified optimal synthesis conditions using non-negative matrix factorization.

SourceTokyo University of Science·JournalScience and Technology of Advanced Materials Methods·TypeExperimental study·DateJun 16, 2022

2D material in three dimensions

Scientists at Vienna University of Technology have successfully integrated large surface areas of graphene into limited volumes by producing it on complex branched nanostructures. This breakthrough enables increased storage capacity for hydrogen and higher sensitivity in chemical sensors.

SourceVienna University of Technology·JournalCarbon·TypeExperimental study·DateJan 31, 2022

Novel biosensors set to revolutionise brain-controlled robotics

A novel carbon-based biosensor developed at the University of Technology Sydney detects electrical signals sent by the brain, translating them into commands for autonomous robotic systems. The biosensor overcomes three major challenges in graphene-based biosensing: corrosion, durability, and skin-contact resistance.

SourceUniversity of Technology Sydney·JournalJournal of Neural Engineering·TypeExperimental study·DateDec 21, 2021

How to transform vacancies into quantum information

Scientists have made a breakthrough in controlling the formation of vacancies in silicon carbide, a semiconductor material. The team's simulations tracked the pairing of individual vacancies into a divacancy and discovered the optimal temperatures for creating stable divacancies. This discovery could lead to highly sensitive sensors an...

SourceDOE/Argonne National Laboratory·JournalNature Communications·DateDec 15, 2021

The era of single-spin color centers in silicon carbide is approaching

Researchers from USTC created a divacancy color center array and achieved spin-coherent manipulation of a single divacancy color center at room temperature. The spin color centers showed excellent properties comparable to the diamond NV center, with a 30% spin readout contrast and extended coherence time of up to 23 microseconds.

SourceUniversity of Science and Technology of China·JournalNational Science Review·DateJul 19, 2021

Detecting early-stage failure in electric power conversion devices

A study published in IEEE Transactions on Power Electronics detects the earliest stages of failure in silicon carbide power electronics through real-time acoustic monitoring. The researchers found that increasing acoustic emission signals correspond to progressive damage to aluminum ribbons, allowing for early warning of device failure.

SourceOsaka University·JournalIEEE Transactions on Power Electronics·DateOct 19, 2020

New method gives robust transistors

Scientists at Linköping University and SweGaN have developed a new method to fit together layers of semiconductors, resulting in high-breakdown thin GaN transistors. The transistors can withstand high voltages due to the gradual absorption of strain between layers.

SourceLinköping University·JournalApplied Physics Letters·DateJan 7, 2020

Mysteries behind interstellar buckyballs finally answered

A team of researchers from the University of Arizona has discovered a mechanism creating complex carbon molecules, such as C60, in a simulated planetary nebula environment. The study suggests that these molecules are derived from silicon carbide dust made by dying stars and can be dispersed throughout the interstellar medium.

SourceUniversity of Arizona·JournalThe Astrophysical Journal Letters·DateNov 13, 2019

Graphene takes a step towards renewable fuel

Researchers at Linköping University have developed a method to produce graphene with several layers in a controlled process, enabling the conversion of carbon dioxide and water into renewable fuel. The graphene also exhibits superconducting properties when arranged in a special way.

SourceLinköping University·JournalCarbon·DateNov 7, 2018

A new way to atomically thin materials

Researchers developed a new production method for titanium carbide MXene by selectively etching silicon from titanium silicon carbide, resulting in flakes with unique properties. The process uses mixtures of hydrofluoric acid and an oxidizing agent to weaken silicon bonds and facilitate synthesis.

SourceWiley·JournalAngewandte Chemie International Edition·DateApr 4, 2018

'Fuzzy' fibers can take rockets' heat

The new composite fibers, developed in collaboration with NASA, have strong interlocking connections that make them less prone to cracking and seal the material to prevent oxygen from changing its chemical composition. The fibers are also resistant to high temperatures and can make entire turbo engines significantly lighter.

SourceRice University·JournalACS Applied Materials & Interfaces·DateMar 30, 2017

The graphene-paved roadmap

The graphene-paved roadmap outlines the material's potential for transforming various industries, including electronics and medicine. With its unique properties, graphene is expected to play a crucial role in developing new technologies such as flexible devices, rollable e-paper, and high-speed wireless communications.

SourceUniversity of Manchester·JournalNature·DateOct 10, 2012