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Review of thermal design of SiC power module for motor drive in electrical vehicle application

11.05.24 | CES Transactions on Electrical Machines and Systems

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Fig. 3. 2.5-dimensional LBM.
As shown in Fig. 3, to coordinate 2D LBM and 3D LBM, proposes a combination method of employing the LBM for genetic algorithms. D3Q7 was selected for solve thermal conduction problem, and a combination of the D2Q5 model and D2Q9 model was adopted for solve force convection conduction problem.  https://doi.org/10.30941/CESTEMS.2024.00041 Credit: CES Transactions on Electrical Machines and Systems (CES TEMS)

Research content

The paper investigates the thermal design of SiC power modules for motor drives in electric vehicles, with a focus on optimizing the layout of Pinfin structures to enhance thermal performance. It explores the impact of irregularly arranged Pinfins on reducing thermal resistance and temperature differences within power modules. The research also introduces a collaborative thermal design strategy that includes DC bus capacitors and motors, aiming to improve overall heat dissipation. The paper contributes to the development of high power density motor drives by providing essential insights and optimization methods for thermal management in electric vehicle applications.

The research results and their significance

This paper reviews the thermal design of Silicon Carbide (SiC) power modules used in electric vehicle (EV) motor drives, highlighting the challenges and advancements in optimizing irregularly arranged Pinfin structures. The authors emphasize that current thermal design practices rely heavily on empirical knowledge, which limits the performance of power modules. The study explores how irregular Pinfin layouts can enhance thermal characteristics by reducing thermal resistance and minimizing temperature differentials among chips.

The paper outlines a two-step optimization approach: first, generating unique irregular Pinfin layouts using algorithms to improve design quality; second, efficiently evaluating these layouts to ensure simulation accuracy and speed. The authors also propose collaborative thermal design involving DC bus capacitors and motors to improve overall heat dissipation effectiveness.

Key findings indicate that irregular Pinfin arrangements can significantly enhance heat transfer efficiency and reduce pressure drops compared to regular layouts. The paper emphasizes the need for innovative cooling solutions and advanced modeling techniques to address the complex thermal dynamics in EV applications. The research outcomes aim to support the development of high power density motor drives, ultimately contributing to the advancement of electric vehicle technology.

Future outlook

It is hoped that the quantitative representation and automatic generation methods of pin-fin layout schemes, efficient evaluation methods and collaborative thermal design can be completed in the future. The main design goal is to reduce the thermal resistance to the shell and reduce the temperature difference between the chips. The optimization of thermal management of power modules for future electric vehicles may involve a balance between innovative design, practical manufacturing processes and economic feasibility. In the future, driven by EV technology's relentless pursuit of efficiency and performance, these optimizations are likely to become more transparent and standardized, allowing for wider industry adoption and competition.

CES Transactions on Electrical Machines and Systems

10.30941/CESTEMS.2024.00041

Literature review

Not applicable

CES Transactions on Electrical Machines and Systems (CES TEMS)

25-Sep-2024

Additional Media

Fig. 4. Simulation of collaborative motor drive system.
Authors’ team proposes to initially employ CFD or 3D LBM simulations for various typical liquid-cooling interconnect schemes of capacitors and motors. Subsequently, surface data can be extracted to establish a database, and finally a 2.5-dimensional LBM model can be formed using interpolation techniques, as shown in Fig. 4. In optimization algorithms, simplified models can facilitate efficient collaborative simulations of Pinfin layouts. https://doi.org/10.30941/CESTEMS.2024.00041 Credit: CES Transactions on Electrical Machines and Systems (CES TEMS)
Fig. 1. Typical Pinfin configuration. (a) Single sided.
Pinfin configurations in power modules are currently designed with either single-sided or double-sided, and the typical products is shown in Fig. 1. The performance of Pinfin cooling still has considerable potential for improvement, which can effectively promote the performance of SiC devices.  https://doi.org/10.30941/CESTEMS.2024.00041 Credit: CES Transactions on Electrical Machines and Systems (CES TEMS)
Fig. 2. Temperature difference caused by chips position and fluid flow.
So far, optimization methods for irregular Pinfin layouts are not clearly investigated. To address this issue, the author’s team has proposed the possibility of optimizing the design of irregularly arranged Pinfin structures, as depicted in Fig. 8. In this method, the primary objective of heat dissipation optimization is to reduce the thermal resistance of the powe module, and simutaneously minimize the temperature difference among the chip junctions as much as possible.  https://doi.org/10.3094 Credit: CES Transactions on Electrical Machines and Systems (CES TEMS)
Fig. 1. Typical Pinfin configuration. (b) Double sided.
Pinfin configurations in power modules are currently designed with either single-sided or double-sided, and the typical products is shown in Fig. 1. The performance of Pinfin cooling still has considerable potential for improvement, which can effectively promote the performance of SiC devices.   https://doi.org/10.30941/CESTEMS.2024.00041 Credit: CES Transactions on Electrical Machines and Systems (CES TEMS)

Keywords

Electric Vehicles Heat Heat Transport Motor Development Power Industry Silicon Carbides

Article Information

Journal
CES Transactions on Electrical Machines and Systems
DOI
10.30941/CESTEMS.2024.00041
Method of Research
Literature review
Subject of Research
Not applicable
Article Publication Date
2024-09-25
Article Title
CES Transactions on Electrical Machines and Systems (CES TEMS)

Contact Information

Yaxi Zhang
CES Transactions on Electrical Machines and Systems
zyxzyx17@126.com

Source

Original Source
https://ieeexplore.ieee.org/document/10702522

How to Cite This Article

APA:
CES Transactions on Electrical Machines and Systems. (2024, November 5). Review of thermal design of SiC power module for motor drive in electrical vehicle application. Brightsurf News. https://www.brightsurf.com/news/L59WWN98/review-of-thermal-design-of-sic-power-module-for-motor-drive-in-electrical-vehicle-application.html
MLA:
"Review of thermal design of SiC power module for motor drive in electrical vehicle application." Brightsurf News, Nov. 5 2024, https://www.brightsurf.com/news/L59WWN98/review-of-thermal-design-of-sic-power-module-for-motor-drive-in-electrical-vehicle-application.html.