Articles tagged with Thermal Conductivity
Researchers discovered that bundling boron nanoribbons can significantly increase their thermal conductivity. The flat surface structure of the nanoribbons allows for tighter contact between individual structures through van der Waals interactions, enabling efficient phonon transmission and enhanced heat transfer.
Researchers at Vanderbilt University discovered a new way to enhance thermal conductivity, allowing for cooler computer chips and lasers. The technique involves controlling the interface between two thin strips of material, such as boron nanoribbons, with different solutions.
Phase change materials exhibit surprisingly low thermal conductivity in both crystalline and amorphous states. The researchers found that resonance bonding between atoms in the crystalline state impairs heat conduction. This property makes phase change materials suitable for developing fast, non-volatile, and energy-saving main memories.
Researchers found that supported graphene retains exceptional thermal conductivity of up to 600 watts per meter per Kelvin near room temperature. This is significantly higher than copper and silicon thin films currently used in electronic devices.
Researchers at MIT have developed a method to transform polyethylene into a thermally conductive material, outperforming some metals in thermal conductivity. The new process involves aligning polymer molecules to enhance heat transfer efficiency.
Researchers at the University of Copenhagen have discovered a new understanding of thermoelectric materials that can efficiently convert waste heat into electrical energy. This breakthrough has the potential to significantly improve fuel economy in vehicles and contribute to more environmentally friendly cooling methods.
Researchers developed a 'slug calorimeter' technique to measure thermal conductivity of fireproofing materials under extreme heat. This new method has been adopted commercially and published as a national standard, with potential applications in steel fireproofing, wood-based materials, and spacecraft insulation.
Scientists at the University of Oregon developed a new insulation material with an ultra-low thermal conductivity, which could lead to improved energy efficiency in various applications. The material's unique structure allows it to be both dense and effective as a thermal insulator.
New NIST study reveals portable radios can't withstand high-temp fires without protective gear, posing communication risks to firefighters. Radios inside pockets or gear fared better, but exposed components failed quickly.
Researchers at Purdue University have developed thermal interface materials with carbon nanotubes that conduct heat more efficiently than conventional materials. The nanotube-based interfaces can reduce the temperature rise of computer chips by up to 5 degrees Celsius, improving overall performance and reducing the risk of damage.
Scientists have created a better thermal insulator by introducing structure on the nanometer length scale in materials. The new nanolaminates exhibit a three times lower thermal conductivity than conventional insulators, due to the strong impediment of heat transfer at the interfaces.
Researchers at the University of Pennsylvania have created a method to mix single-walled carbon nanotubes into polymers for enhanced strength, conductivity, and thermal stability. The technique uses coagulation to disperse nanotubes evenly, achieving significant improvements in material properties.
Researchers found that carbon nanotubes exhibit lower thermal conductivity when integrated into other materials due to interfacial resistance. Despite this, they remain optimistic about using nanotubes to improve insulating materials.
Researchers have developed thin layer silicon with improved lattice vibrational frequency, leading to a 30% increase in thermal conductivity. This breakthrough enables faster charging and more efficient heat conduction in digital semiconductor devices.
Researchers at the University of Pennsylvania have developed a new type of epoxy that is three times harder and conducts heat significantly better than regular epoxy. The addition of carbon nanotubes to the adhesive yields enhanced thermal conductivity and mechanical strength.
Scientists have discovered that single-isotope silicon can conduct heat more efficiently than natural silicon, with a 60% improvement in thermal conductivity at room temperature. This enhancement is attributed to the suppression of phonon scattering caused by fluctuations in atomic masses, resulting in improved heat transfer rates.