As artificial intelligence models grow to billions of parameters, traditional computing architectures face mounting challenges in energy efficiency, processing speed, and hardware scalability. Now, researchers from The Hong Kong Polytechnic University and The Education University of Hong Kong, led by Professor Bingang Xu and Professor Hong Fu, have published a comprehensive review on the advanced design of high-performance and AI chips. This work offers critical insights into next-generation chip technologies that can meet the demands of modern AI applications.
Why Advanced AI Chips Matter
Innovative Design and Features
Applications and Future Outlook
This comprehensive review provides a strategic roadmap for the development of advanced AI chips. It underscores the importance of interdisciplinary collaboration across materials science, electronics, and computer science to drive innovation in AI hardware. Stay tuned for more groundbreaking work from Professor Bingang Xu and Professor Hong Fu!
Nano-Micro Letters
Experimental study
Advanced Design for High‑Performance and AI Chips
29-Jul-2025