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A hierarchical short microneedle‑cupping dual‑amplified patch enables accelerated, uniform, pain‑free transdermal delivery of extracellular vesicles

10.09.25 | Shanghai Jiao Tong University Journal Center

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Transdermal delivery of biologics like extracellular vesicles (EVs) holds great promise for regenerative medicine and dermatological therapy. However, the stratum corneum poses a formidable barrier, especially for large and delicate molecules such as EVs. While microneedles (MNs) offer a minimally invasive solution, long needles (≥600 μm) often cause pain and irritation, and short needles struggle with limited penetration depth. Now, researchers from Sungkyunkwan University, led by Prof. Changhyun Pang and Prof. Jae Hyung Park, have developed a bio-inspired, dual-amplified transdermal patch (MN@EV/SC) that enables pain-free, uniform, and deep delivery of EVs using short microneedles.

Why This Matters

Innovative Design and Features

Applications and Future Outlook

This work highlights the power of bio-inspired engineering in overcoming biological barriers and opens new avenues for EV-based therapeutics. Stay tuned for more innovations from Prof. Pang and Prof. Park’s teams at Sungkyunkwan University!

Nano-Micro Letters

10.1007/s40820-025-01853-7

Experimental study

A Hierarchical Short Microneedle‑Cupping Dual‑Amplified Patch Enables Accelerated, Uniform, Pain‑Free Transdermal Delivery of Extracellular Vesicles

23-Jul-2025

Keywords

Article Information

Contact Information

Bowen Li
Shanghai Jiao Tong University Journal Center
qkzx@sjtu.edu.cn

Source

How to Cite This Article

APA:
Shanghai Jiao Tong University Journal Center. (2025, October 9). A hierarchical short microneedle‑cupping dual‑amplified patch enables accelerated, uniform, pain‑free transdermal delivery of extracellular vesicles. Brightsurf News. https://www.brightsurf.com/news/LVDG4NYL/a-hierarchical-short-microneedlecupping-dualamplified-patch-enables-accelerated-uniform-painfree-transdermal-delivery-of-extracellular-vesicles.html
MLA:
"A hierarchical short microneedle‑cupping dual‑amplified patch enables accelerated, uniform, pain‑free transdermal delivery of extracellular vesicles." Brightsurf News, Oct. 9 2025, https://www.brightsurf.com/news/LVDG4NYL/a-hierarchical-short-microneedlecupping-dualamplified-patch-enables-accelerated-uniform-painfree-transdermal-delivery-of-extracellular-vesicles.html.