A novel capacitorless solid-state power filter (SSPF) has been developed for single-phase DC-AC converters, eliminating the need for LC filters and dc-link capacitors. The proposed concept demonstrates a significant reduction in critical components, leading to enhanced efficiency and reliability.
Researchers develop a novel method for epitaxial growth of 1D metallic materials with widths less than 1 nm, enabling ultra-miniaturized transistor devices. The technology shows promise for next-generation semiconductors and basic materials science.
Researchers develop cost-effective dual self-alignment technique to eradicate parasitic capacitance in organic thin-film transistors and rectifying diodes, boosting device performance and efficiency. The breakthrough enables flexible electronics with reliable performance at lower power levels and reduced energy loss.
The study found that 3D integration can lead to significant heat spreading and crosstalk, reducing heater efficiency by up to -43.3% and increasing thermal crosstalk by up to +44.4%. However, optimizing design variables, such as spacing between µbumps and interconnect linewidth, can minimize the thermal penalty of 3D integration.