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Science News for April 11, 2003


Tiny bubbles are key to liquid-cooled system for future computers

Purdue University researchers have created a 'pumpless' liquid-cooling system that removes nearly six times more heat than existing miniature pumpless systems. The system uses microchannels and dielectric liquids to form smaller bubbles, which flow easily through the channels and carry heat away from computer chips.

SourcePurdue University·JournalIEEE Transactions on Components and Packaging Technologies·DateApr 11, 2003