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Science News for July 3, 2021


Stress-free path to stress-free metallic films paves the way for next-gen circuitry

Researchers from Tokyo Metropolitan University have developed a method to create thin films of tungsten with minimal stresses using high power impulse magnetron scattering. This breakthrough technology enables efficient deposition of metallic films without heat treatment, opening up new possibilities for the electronics industry.

SourceTokyo Metropolitan University·JournalJournal of Applied Physics·DateJul 3, 2021