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Science News for June 23, 2024


A novel package for high power density SIC power modules

This study introduces a novel package for high-power density SiC power modules using stacked DBC packaging, enabling the parallel connection of more chips. The design reduces parasitic inductance and increases current carrying capacity, resulting in improved electrical performance and manufacturing efficiency.

SourceCES Transactions on Electrical Machines and Systems·JournalCES Transactions on Electrical Machines and Systems·TypeExperimental study·DateJun 23, 2024