Cosmic rays generated by particles from outside the solar system can alter individual bits of data stored in memory, causing single-event upsets (SEUs) that can be difficult to characterize. The problem is becoming increasingly serious as computer chip technology advances and becomes smaller.
Researchers at UC San Diego have fabricated a semiconductor-free microelectronic device using metamaterials, showing a 1,000% increase in conductivity. The discovery paves the way for faster and more powerful devices, as well as more efficient solar panels.
A $450,000 grant will fund a collaboration between Indiana University and the US Navy to develop new methods for inspecting microelectronic components used in critical military systems. Computer vision technology will be applied to improve the integrity of electronic circuitry, reducing defects and ensuring equipment reliability.
Researchers found that repeated spot microdischarges in microelectronic devices cause a temperature increase, which reduces the electric field and leads to preferential breakdown at the previous discharge location. This study provides insights into the role of residual heat build-up and its impact on device stability.
Researchers at Oregon State University have developed a new method to fabricate silver nanoparticles for printed electronics at room temperature. This breakthrough has the potential to open up new applications in fields such as solar cells, printed circuit boards, and low-emissivity coatings.
Researchers created high-performance 3D lithium-ion microbatteries using 3D holographic lithography and 2D photolithography. The battery has exceptional performance, scalability, and can be integrated with microelectronic devices.
A new thermal imaging technique called plasmon energy expansion thermometry (PEET) allows for precise temperature mapping in tiny electronic circuits. This can help engineers design microprocessors that minimize overheating and improve device performance.
Scientists at USC and UCLA have discovered a way to accurately measure temperatures inside microelectronic devices using a novel technique called Plasmon Energy Expansion Thermometry (PEET). This breakthrough enables better thermal management, leading to faster transistors and lower power consumption.
Researchers from Cambridge University have devised a simple technique to grow carbon nanotubes at five times higher density than previous methods, enabling the potential replacement of metal electronic components in devices such as batteries and spacecraft.
Researchers developed a magnetically actuated peel test technique to measure adhesion strength between thin films in microelectronic devices, photovoltaic cells and MEMS. The fixtureless and non-contact method helps ensure long-term reliability and resistance to thermal and mechanical stresses.
Scientists at the University of Southampton and collaborators are developing new materials like amorphous chalcogenides, bridging glass and semiconductor technology. The project aims to improve device energy efficiencies and support UK's communication and healthcare sectors.
The Megaframe Imager, a new ultrafast camera, uses an extremely sensitive SPAD device to detect viral DNA binding events at low target concentrations. This technology has potential applications in biological processes, automotive collisions, and astronomical observations.
Researchers develop electronic biosensing technology that can detect gene mutations indicative of cancer, potentially leading to faster and more accurate diagnoses. The new platform uses disposable arrays containing thousands of electronic sensors connected to powerful signal processing circuitry.
University of Illinois engineers developed a novel direct-write technique to manufacture metal interconnects, enabling smaller chips and more complex functions. The technique reduces wire bonding area by two orders of magnitude, allowing for faster and more efficient manufacturing.
Researchers at UMass Amherst and Berkeley developed a new method for producing defect-free, thin polymer films using layered block copolymers. The technique achieved densities over 15 times higher than previous efforts, enabling up to 10 terabits per square inch of storage space.
Researchers at NIST demonstrate assembly of a single layer of organic molecules on a silicon crystal substrate compatible with CMOS manufacturing technology. The team builds a working molecular electronic device and verifies its functionality, paving the way for hybrid CMOS-molecular devices.
Researchers at MIT have developed a new transistor technology that could lead to faster operation and smaller devices. The transistors, made from indium gallium arsenide, are 60 nanometers long and can switch and process information quickly.
Scientists at University of Wisconsin-Madison develop technique to time events at the atomic scale, enhancing understanding of material properties and enabling improved memory applications in microelectronics. The breakthrough uses X-rays from Argonne National Laboratory's Advanced Photon Source.
Researchers have developed graphene circuitry comparable to carbon nanotubes, allowing for high-volume production. The material exhibits high electron mobility and coherence, enabling the transport of electrons through waveguides. Challenges ahead include improving patterning techniques and understanding fundamental properties.
Graphene, a material that gives pencils their marking ability, has been used to produce proof-of-principle transistors, loop devices, and circuitry. The researchers hope to use graphene layers as the basis for revolutionary electronic systems that would manipulate electrons as waves rather than particles.
Researchers at Northwestern University have developed a custom-built scanning tunneling microscope to image individual organic molecules on silicon, refining design constraints for molecular electronic devices. The study has also provided insight into surface chemistry, with potential applications in sensing, catalysis, and lubrication.
The Center for Advanced Microelectronics Manufacturing (CAMM) will combine resources from academia, government, and industry to speed up microelectronics manufacturing research and development in a roll-to-roll format. CAMM's R2R research capabilities include flexible displays, 'foldable' radars, and protective clothing.
A team of engineers at Northwestern University has developed a method for precisely aligning multiple types of molecules on a silicon surface at room temperature. This breakthrough enables the construction of nanoscale systems such as molecular transistors or light-emitting diodes, and paves the way for integrating with current technol...
Materials scientist George Harman suggests using corrosion-resistant metals like gold and newer polymers to create microelectronic interconnections that can withstand extreme temperatures. He also proposes the use of flip chips with gold contacts to produce heat-resistant spacecraft electronics.
Researchers developed a hybrid approach to improve microelectronics production, combining lithography and self-assembling materials to achieve nanoscale dimensions. This technology could lead to faster, more powerful devices with increased data capacity, while reducing manufacturing costs.
Researchers at UW-Madison developed a novel diamond film that can be used as a stable platform for biological sensing. The films have proven to be remarkably durable and can withstand multiple cycles of processing DNA, making them suitable for continuous monitoring in high-risk environments.
A UMass research team has developed a new technique for depositing copper films within tiny channels in silicon wafers, promising efficient fabrication of future generations of integrated circuits. The process uses carbon dioxide as a supercritical fluid, offering environmental benefits and the ability to create complex features.
Sandia National Laboratories' tiny acoustic wave sensors can detect specific chemicals in the environment and alert people to potential hazards. The sensors, similar to a 'canary in a mine,' are part of a hand-held chemical detection system called 'chem lab on a chip.'