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Lab to fab at the wafer-scale for SiC

Researchers at Kyoto University have developed a new SiC transistor structure that can operate at 600°C, scaling up production to wafer-level for high-temp applications. The team's achievement enables the fabrication of integrated circuits, opening doors to new areas like jet engine sensors and geothermal resource development.

SourceKyoto University·TypeExperimental study·DateSep 27, 2026

New framework for adoption of distributed energy resources quantifies uncertainty, ensures validity across grid structures

Researchers propose a data-driven forecasting approach to predict DER adoption patterns and quantify uncertainty for more informed decision making. The framework provides plausible adoption scenarios, enabling utilities, regulators, and planners to make strategic investments and plan for long-term infrastructure needs.

SourceCarnegie Mellon University·JournalAnnals of Applied Sciences·DateAug 3, 2026

Topology helps build more robust photonic networks

Researchers have shown that topology can guide multiple, information-carrying light signals through chip-based photonic communication systems, making them more powerful and reliable. This breakthrough could enable the creation of networks of chips that communicate using light while taking advantage of topology's robustness.

SourceUniversity of Pennsylvania School of Engineering and Applied Science·JournalNature Physics·TypeExperimental study·DateMar 19, 2026

Back to the future: Is light-speed analog computing on the horizon?

Scientists have developed a programmable electronic circuit that harnesses high-frequency electromagnetic waves to perform complex parallel processing at light-speed. This breakthrough has the potential to power next-generation wireless networks, real-time radar, and advanced monitoring in various industries.

SourceUniversity of Technology Sydney·JournalNature Communications·TypeComputational simulation/modeling·DateOct 6, 2025

Machine learning-based design enables more efficient wireless power transfer

A new machine learning-based design method has been proposed to achieve stable and efficient wireless power transfer. The approach uses real-world circuit modeling and numerical simulations to optimize system performance, demonstrating significant improvements in output voltage stability and power-delivery efficiency.

SourceChiba University·JournalIEEE Transactions on Circuits and Systems I Regular Papers·TypeExperimental study·DateAug 5, 2025

Incheon National University study pioneers breakthrough in wireless charging technology

Researchers at Incheon National University have pioneered a novel resonant tuning rectifier (RTR) for parallel compensated receivers in wireless power transfer. The RTR enhances efficiency via dynamic frequency adaptation, reducing circuit impedance and minimizing interference with other devices.

SourceIncheon National University·JournalIEEE Transactions on Industrial Electronics·TypeExperimental study·DateFeb 19, 2025

Major breakthrough for ‘smart cell’ design

Researchers have made a major breakthrough in synthetic biology by developing a new construction kit for building custom sense-and-respond circuits in human cells. The new approach harnesses the power of phosphorylation to amplify weak input signals into macroscopic outputs, enabling rapid response times and sensitivity to external sig...

SourceRice University·JournalScience·TypeExperimental study·DateJan 3, 2025

Programming cells: Revolutionizing genetic circuits with cutting-edge RNA tools

The team developed a Synthetic Translational Coupling Element (SynTCE) that enhances the precision and integration density of genetic circuits in synthetic biology. This allows for more efficient gene circuit integration, minimizing interference between biological parts and enabling precise control over multiple genes.

SourcePohang University of Science & Technology (POSTECH)·JournalNucleic Acids Research·DateDec 20, 2024

Unlocking next-gen chip efficiency: UVA researchers confirm thermal insights for tiny circuits

Researchers at the University of Virginia have confirmed a key principle governing heat flow in thin metal films, paving the way for advancements in technology and more efficient devices. The study validated Matthiessen's rule in ultra-thin copper films, providing a blueprint to mitigate thermal bottlenecks.

SourceUniversity of Virginia School of Engineering and Applied Science·JournalNature Communications·TypeExperimental study·DateNov 4, 2024

Foam fluidics showcase Rice lab’s creative approach to circuit design

Engineers have shown that air flow through open-cell foam can be used to perform digital computation, analog sensing, and combined digital-analog control in soft textile-based wearable systems. The researchers designed foam-based fluidic resistors to create two-dimensional pneumatic logic circuits embedded in textile-based devices.

SourceRice University·JournalAdvanced Functional Materials·TypeExperimental study·DateJul 24, 2024

A high-boost and high-efficiency DC power converter

The new circuit design uses resonant tank circuits to store energy during switching periods, reducing losses and increasing efficiency. It also employs a planar transformer for compactness and good thermal performance. The prototype achieved an unprecedented 91.3% energy efficiency and reduced electromagnetic noise.

SourceKobe University·JournalIEEE Transactions on Power Electronics·TypeExperimental study·DateApr 1, 2024

Mixed-dimensional transistors enable high-performance multifunctional electronic devices

Researchers at City University of Hong Kong developed mixed-dimensional anti-ambipolar transistors for multifunctional electronics, enabling higher information density and lower power consumption. The new technology paves the way for simplified chip circuit design and versatile applications in digital and analog signal processing.

SourceCity University of Hong Kong·JournalDevice·TypeExperimental study·DateFeb 23, 2024

Refreshing a computer chip to a “chiplet”

A team of researchers from Pitt and Notre Dame have received a $2 million NSF grant to develop 'chiplets' - refurbished integrated chips that can be reused in new products, reducing manufacturing waste and emissions. The project aims to create a more sustainable computing lifecycle by mapping the reuse of decommissioned FPGAs.

Electrons take flight at the nanoscale

A new device design inspires improved integrated circuit designs by visualizing electric current flow lines around sharp bends. The research enables better understanding of heat generation in electronic devices, leading to more efficient circuit creation and reduced risk of overheating.

SourceUniversity of California - Riverside·JournalProceedings of the National Academy of Sciences·TypeExperimental study·DateSep 18, 2023

A golden ticket to smaller electronics

A team of researchers at Osaka University developed a new method for direct three-dimensional bonding of copper electrodes using silver, enabling reliable connections at low temperatures without external pressure. The process can be performed under gentle conditions, resulting in permanent connections as small as 20 micrometers.